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  1. Kulicke Soffa, dicing saw repair and spindle repair.

    SperryTek provides maintenance and service to the Semi Industry. Kulicke & Soffa Dicing (K&S) Saw Repair, Disco Saw Repair, Automatic and Manual Wire Bonders.
    Chuck2
    ADT1
    Spindle Repair1
    Air Bearing1
    wire bonder1
    Wire Bonders1
    dicing saw1
    Manual Bonder1
    Kulicke & Soffa1
    wafer saw1
    disco dicing saw1
    Dicing Repair0
    K&S 41230
    K&S 41240
    KS71000
    KS75000
    KS7800
    Kulicke & Soffa 9800
    Wafer Repair0
    wafer wire0

    www.sperrytek.com - 2009-02-06

  2. Welcome to Keteca Online

    Copyright 2006 Keteca Singapore (Pte) Ltd skip intro
    laser3
    semiconductor2
    surfactant1
    saw blade1
    dicing1
    wafer dicing1
    wafer saw1
    dicing solution1
    diamablade0
    diamaflow0
    keteca0
    keteca laser0

    www.keteca.com - 2009-02-05

  3. Perfection Products - For All Your Handling Needs

    Affordable, guaranteed highest quality Microprocessor and Semiconductor device holders, magazines, carriers and shippers for every step of the design and ...
    quality4
    rails2
    semiconductor2
    processor2
    microprocessor1
    perfection1
    IC packaging1
    semiconductor devices1
    chip trays1
    IC trays1
    Assembly and Packaging1
    microelectronic devices1
    bare die trays1
    film frame shippers1
    matrix trays1
    boat magazines1
    wafer saw1
    wafer shippers1
    grip rings1
    film frames1
    chip tubes0
    expander rings0
    film frame magazines0
    grip ring magazines0
    grip ring shippers0
    lead frame magazines0
    pcb magazines0
    semiconducter magazines0
    to tape magazines0
    to tapes0
    wafer saw frames0

    www.perfection-products.com - 2009-02-06

  4. CHIPS-INC, Custom wafer to die processing

    CHIPS-Inc.wafer to die processing for the semi-conductor industry. Mil I 45208A compliant Class10000 certified clean rooms,Class1 ESD NARTE Certified.
    commercial5
    industrial4
    Inspection3
    ceramic3
    grinding2
    Chips2
    sapphire2
    silicon2
    diodes1
    cmos1
    integrated circuits1
    thinning1
    transistors1
    wafers1
    arrays1
    Pick and place1
    glass cutting1
    dicing1
    Gallium Arsenide1
    semi conductor1
    wafer saw1
    wafer sawing1
    bumped die1
    IC’s1
    die processing tape reel0
    die sawing0
    Ga As mimics0
    ink less0
    Map decoding0
    map picking0
    wafer back lapping0

    www.chips-inc.com - 2009-02-04

integrated circuits1 cutting2 dicing1 connectors2 micro2 map decoding0 electronic components2 inspection3 ink less0 ceramic3 capacitors2

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